IEEE-EDS Distinguished Lecture: Ultra‐thin Chips ‐ a New Paradigm in Silicon Technology

Abstract:
Flexible electronics add mechanical flexibility, adaptivity and stretchability as well as large‐area placeability to electronic systems, thus allowing for
conquering fundamentally new markets in consumer and commercial applications. Hybrid assembly of large‐area devices and ultra‐thin silicon chips
on flexible substrates is now viewed as an enabler to high‐performance and reliable industrial solutions as well as high‐end consumer applications of
flexible electronics. This talk discusses issues in ultra‐thin chip fabrication, device modeling and circuit design, as well as assembly and interconnects for thin chips embedded in foil substrates. Numerous distinct differences to conventional silicon technology justify the statement that ultra‐thin chips features a new paradigm in silicon technology.

Speaker(s): Prof. Joachim Burghartz,

Location:
Room: 1302
Bldg: DC
University of Waterloo
200 University Avenue West
Waterloo, Ontario
N2L3G1