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May 2018

Ultra‐thin Chips ‐ a New Paradigm in Silicon Technology

May 8 @ 10:30 am - 11:59 am EDT
Room: 1302, Bldg: DC

IEEE-EDS Distinguished Lecture: Ultra‐thin Chips ‐ a New Paradigm in Silicon Technology Abstract:Flexible electronics add mechanical flexibility, adaptivity and stretchability as well as large‐area placeability to electronic systems, thus allowing forconquering fundamentally new markets in consumer and commercial applications. Hybrid assembly of large‐area devices and ultra‐thin silicon chipson flexible substrates is now viewed as an enabler to high‐performance and reliable industrial solutions as well as high‐end consumer applications offlexible electronics. This talk discusses issues in ultra‐thin chip fabrication, device modeling…

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